Product Designation
|
Description
|
Typical Application/Benefit
|
Application Method
|
Electrical Resistance
Ω/□/25µm
|
CA-188-2
|
SMT Ag epoxy, one-part
|
Attach SMD/fast low temp cure
|
Needle or jet
|
0.0007 Ω-cm
|
UF-1571
|
SMT staking compound
|
Attach SMD/ compatible with CA-188-2
|
Needle or jet
|
>1,000 Mega Ω
|
DB-1561
|
SMT Ag epoxy, two-part
|
Attach SMD/low temp cure, fine needle dispense
|
Needle
|
0.003 Ω-cm
|
UF-9526
|
SMT staking compound
|
Attach SMD/ compatible with DB-1561
|
Needle
|
>1,000 Mega Ω
|
EC-9519
|
SMT encapsulant, UV cure
|
Protect SMT joint/PET or PC adhesion, low stress
|
Needle or jet
|
>1,000 Mega Ω
|