|
PRODUCT
|
DESCRIPTION
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RESISITIVITY (ohm•cm)
|
Tg (˚C)
Tan Delta |
Viscosity cP (5.0 rpm)
|
Application Method
|
|
Electrically Conductive Die Attach Adhesives
|
|||||
|
561-147-1 |
Low cost, moderate Tg, snap cure, low bleed on cell surfaces. 80°C cure capable. |
4 x 10-4
|
90
|
11,000
|
Needle, Jet, Screen Print
|
|
CA-105 |
High Tg, low cost die attach for small die and LED’s |
3 x 10-4
|
135
|
11,000
|
Dispense
|
|
CA-177 |
Low cost conductive die attach. Good for small die and tantalum capacitors, fast cure |
7 x 10-4
|
93
|
13,000
|
Dispense
|
|
CA-177-S |
Low cost conductive die attach formulated to prevent galvanic corrosion on tin and solder surfaces |
1 x 10-3
|
87
|
13,000
|
Dispense
|
|
CA-180
|
Low temperature cure (cured 30 minutes at 800C), snap cure at 1500C plus (10 seconds at 150°C) |
6 x 10-3
|
50
|
12,000
|
Dispense
|
|
CA-181 |
Low temperature cure (cured 60 minutes at 800C), higher Tg than CA-180 |
2 x 10-4
|
72
|
11,000
|
Dispense
|
|
CA-183 |
Low temperature cure (80°C) flexible ECA |
9 x 10-4
|
20
|
20,000
|
Dispense
|
|
DA-5845-GB |
Chip on board, meets NASA outgassing requirements |
2 x 10-4
|
65
|
25,000
|
Dispense
|
|
DA-5100 |
General purpose chip on board die attach adhesive |
5 x 10-4
|
115
|
17,000
|
Dispense
|
|
High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
|
|||||
|
DA-5933A |
High thermal conductivity, ionically clean die attach for power devices and LED’s, 21W/m0K |
9.0 x 10-5
|
107
|
7,500
|
Pin transfer Dispense
|
|
DA-5990-1 |
High thermal conductivity, ionically clean die attach for power devices and LED’s, 20W/m0K |
5.0 x 10-4
|
140
|
10,000
|
Pin transfer Dispense
|
|
CA-142 |
High thermal conductivity, ionically clean, flexible, low stress solution for large die, 10W/m°K |
2.0 x 10-4
|
5
|
22,000
|
Dispense
|
|
CA-192 |
High thermal conductivity, low cost, ionically clean, 20W/m0K |
1.0 x 10-4
|
145
|
10,000
|
Pin transfer Dispense
|
|
CA-193 |
High thermal conductivity, flexible, low cost, ionically clean, 20W/m0K |
1.0 x 10-4
|
170
|
10,000
|
Pin transfer Dispense
|