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Product
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Description
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Viscosity (cps)
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Tg - DMA
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Cure
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Pot Life at 25°C (hrs)
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Status
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| UV Cure Adhesives and Chip Encapsulants | ||||||
| 535-10M-1 | Hi viscosity elastomeric adhesive for applications requiring extremely low warpage and stress | 400,000 | 5 ⁰C | UV and/or 30 min @ 120°C | 72 | Commercial |
| DC-4261 | Dam material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications | 10,000 | 112 °C | UV and/or 30 min @ 150°C | 72 | Commercial |
| DC-4262 | Fill material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications | 2,000 | 72 °C | UV and/or 30 min @ 150°C | 73 | Commercial |
| EC-9519 | Clear flexible UV cure encapsulant / adhesive | 4,000 | NT | UV | 0.3 | Commercial |
| Camera Module Assembly Adhesives for Lens Holder Assembly | ||||||
| 631-210 | High Tg, low CTE (15ppm), dimensionally stable dual cure for photonic, camera module and general electronics assembly applications | 36,000 | 155 (ARES) | UV and/or 60 min @ 120°C | 24 | Developmental |