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UV Cure Assembly

Product
Description
Viscosity (cps)
Tg - DMA
Cure
Pot Life at 25°C (hrs)
Status
UV Cure Adhesives and Chip Encapsulants
 535-10M-1 Hi viscosity elastomeric adhesive for applications requiring extremely low warpage and stress 400,000 5 ⁰C UV and/or 30 min @ 120°C 72 Commercial
DC-4261 Dam material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications 10,000 112 °C  UV and/or 30 min @ 150°C 72 Commercial
DC-4262 Fill material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications 2,000 72 °C UV and/or 30 min @ 150°C 73 Commercial
 EC-9519 Clear flexible UV cure encapsulant / adhesive 4,000 NT UV 0.3 Commercial
Camera Module Assembly Adhesives for Lens Holder Assembly
631-210 High Tg, low CTE (15ppm), dimensionally stable dual cure for photonic, camera module and general electronics assembly applications 36,000 155 (ARES) UV and/or 60 min @ 120°C 24 Developmental