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Product
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Description
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Viscosity (cps)
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Tg – DMA ( 0C)
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Cure
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Thermal Conductivity W/m0K
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| UV Cure Assembly Adhesives and Encapsulants | |||||
| 535-32 | Low viscosity epoxy adhesive/encapsulant, contains secondary thermal cure | 1,200 | 2 | UV + 20 min @ 1100C | 0.3 |
| 535-11M-7 | Dispensible epoxy adhesive/encapsulant, contains secondary thermal cure | 12,000 | 5 | UV + 20 min @ 1100C | 0.3 |
| 535-18M-62 | Medium viscosity developed for damping and general adhesive applications | 75,000 | 30 | UV | 0.3 |
| UV-9108 | UV cured acrylate, low viscosity, rapid cure, good adhesion to PVC, polycarbonate | 1,400 | 40 | UV | 0.3 |
| UV Cure Chip Encapsulants | |||||
| 451-268 | Dam material for danm and fill chip encapsulation. Good for smart cards and general circuit assembly applications | 10,000 | 1120C | UV and/or 30 min @ 1500C | 72 hours |
| 451-269 | Fill material for danm and fill chip encapsulation. Good for smart cards and general circuit assembly applications | 2,000 | 720C | UV and/or 30 min @ 1100C | 73 hours |
| Camera Module Assembly Adhesives for Lens Holder Assembly | |||||
| 631-28 | Designed for lens holder bonding in camera modules can be used for any assembly process requiring UV tack plus thermal cure | 27,000 | 107 | UV and/or 15 min @ 1100C | Dispense Stencil Print |
| 631-39 | Low shrinkage adhesive designed for lens holder bonding and other micro assembly applications | 33,000 | 92 | UV and/or 15 min @ 1100C | Dispense Stencil Print |
| 631-68 | Extremely low CTE, low shrinkage adhesive designed for lens holder bonding and other micro assembly applications. High Tg | 80,000 | 140 | UV and/or 15 min @ 1100C | Dispense Stencil Print |