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PRODUCT
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DESCRIPTION
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RESISITIVITY (ohm•cm)
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Tg (˚C)
Tan Delta |
Viscosity cP (5.0 rpm)
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Thermal Conductivity W/m⁰K
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Application Method
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Status
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High Thermal Conductivity, Electrically Conductive Die and Component Attach Adhesives
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|||||||
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CA-146 |
High thermal conductivity, flexible die attach for power devices, large die |
5.0 x 10 -5
|
20
|
14,000
|
10
|
Pin transfer Dispense
|
Developmental
|
|
CA-188-2 |
High thermal conductivity, low temperature cure (80⁰C), low stress solution |
7.0 x 10 -4
|
62
|
17,000
|
5
|
Dispense, Jet
|
Developmental
|
|
CA-191 |
High thermal conductivity, power devices, small die, LED's, light stable |
5.0 x 10 -5
|
136
|
10,000
|
25
|
Pin transfer Dispense
|
Developmental
|
|
DA-5990-1 |
High thermal conductivity die attach for power devices and LED's |
5.0 x 10 -4
|
140
|
10,000
|
20
|
Pin transfer Dispense
|
Commercial
|
|
DB-1588-7 |
High thermal conductivity, flexible, low cost |
4.0 x 10 -4
|
7
|
35,000
|
6
|
Stencil Print
|
Commercial
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