| Product | Description | Resistivity (ohm•cm) | Tg (˚C) Tan Delta |
Viscosity cP (5.0 s-1) | Application Method |
| Conductive Adhesives for Back Contact Applications |
|||||
| CA-150-H | Low cost, low Tg, snap cure, low bleed on cell surfaces. Recommended for stringing or shingling | 5 x 10-4 | -10 | 25,000 | Stencil Print |
| DB-1588-4 | Lowest cost of the DB-1588-series materials. Faster cure for fast cure EVA encapsulants | 2 x 10-4 | 0 | 35,000 | Stencil Print |
| DB-1588-6 | Lowest cost, flexible, excellent damp heat performance on OSP treated copper. | 4 x 10-4 | 5 | 10,000 | Dispense Jet |
| FE-106 | Low cost, flexible, excellent damp heat performance on OSP treated copper. Formulated for Formula E manufacturing lines | 4 x 10-4 | 4 | 11,000 | Dispense Jet |