| Flex Circuit and Printer Head Assembly Adhesives | |||||
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PRODUCT
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DESCRIPTION
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VISCOSITY (cps)
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Tg – DMA
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CURE
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Pot Life at 25°C (hrs)
|
|
357-346-5 |
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance |
20,000
|
60
|
60 min @ 80 degrees C 3min @ 150 degrees C
|
72 Hours
|
|
357-348 |
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance |
9,500
|
50
|
60 min @ 80 degrees C 5 min @ 150 degrees C
|
72 Hours
|
|
357-284
|
White, high thixotropy adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance |
110,000
|
65
|
40 min @ 80 degrees C 1 min @ 150 degrees C
|
72 Hours
|
|
451-107-4 |
Low viscosity, electrically insulating die attach adhesive |
3,500
|
50
|
60 min @ 80 degrees C 15 min @ 120 degrees C
|
48 Hours
|
|
EN-7150
|
Tan, low viscosity adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance, high Tg
|
15,000
|
106
|
30 min @ 110 degrees C
|
72 Hours
|
| Camera Module Assembly Adhesives for Lens Holder Assembly | |||||
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631-28 |
Designed for lens holder bonding in camera modules can be used for any assembly process requiring UV tack plus thermal cure |
27,000
|
107
|
UV and/or 15 min @ 110 degrees C
|
Dispense Stencil Print
|
|
631-39 |
Low shrinkage adhesive designed for lens holder bonding and other micro assembly applications |
33,000
|
92
|
UV and/or 15 min @ 110 degrees C
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Dispense Stencil Print
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|
631-68 |
Extremely low CTE, low shrinkage adhesive designed for lens holder bonding and other micro assembly applications. High Tg |
80,000
|
140
|
UV and/or 15 min @ 110 degrees C
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Dispense Stencil Print
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| UV Cure Chip Encapsulants | |||||
|
451-268 |
Dam material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications |
10,000
|
112 degrees C
|
UV and/or 30 min @ 150 degrees C
|
72 Hours
|
|
451-269 |
Fill material for dam and fill chip encapsulation or cavity fill. Good for smart cards and general circuit assembly applications |
2,000
|
72 degrees C
|
UV and/or 30 min @ 150 degrees C
|
73 Hours
|