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PRODUCT
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DESCRIPTION
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Resistivity (ohm•cm)
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Tg (°C) Tan Delta
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Viscosity cP (5.9 rpm)
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Application Method
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| High Thermal Conductivity, Electrically Conductive LED Die Attach Adhesives | |||||||||||||||||
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CA-105 |
High Tg, low cost die attach for small die and LED’s |
3 x 10-4
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135
|
11,000
|
Dispense
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CA-190-2
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High thermal conductivity, low cost |
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Dispense
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CA-190-3 |
High thermal conductivity, flexible, low cost 10 W/mK |
Dispense
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DA-5933A |
High thermal conductivity (21W/m0K), ionically clean die attach for power devices and LED’s |
9.0 x 10-5
|
107
|
7,500
|
Pin transfer Dispense
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DA-5990-1 |
High thermal conductivity (20W/m0K), ionically clean die attach for power devices and LED’s |
5.0 x 10-4
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140
|
10,000
|
Pin transfer Dispense
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| Transparent LED die attach/encapsulants | |||||||||||||||||
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DA-5887-9 |
Transparent epoxy adhesive designed for LED die attach or encapsulation |
12,000
|
134
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30 min @ 150°C
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0.3
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DA-5898 |
Transparent epoxy adhesive designed for LED die attach or encapsulation |
9,000
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70
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30 min @ 150°C
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0.3
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