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Product Designation
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Description
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Typical Application/Benefit
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Application Method
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Electrical Resistance
Ω/□/25µm
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CA-188-2
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SMT Ag epoxy, one-part
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Attach SMD/fast low temp cure
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Needle or jet
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0.0007 Ω-cm
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|
UF-1571
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SMT staking compound
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Attach SMD/ compatible with CA-188-2
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Needle or jet
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>1,000 Mega Ω
|
|
DB-1561
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SMT Ag epoxy, two-part
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Attach SMD/low temp cure, fine needle dispense
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Needle
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0.003 Ω-cm
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|
UF-9526
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SMT staking compound
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Attach SMD/ compatible with DB-1561
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Needle
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>1,000 Mega Ω
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EC-9519
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SMT encapsulant, UV cure
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Protect SMT joint/PET or PC adhesion, low stress
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Needle or jet
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>1,000 Mega Ω
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